The conference programme will highlight the most innovative and exciting aspects of large-area electronics (including printable, flexible or organic electronics), emerging technologies, their manufacture and the development of products incorporating large-area electronics (LAE).

innoLAE 2019 will feature plenary and parallel track oral presentations, a poster session, an exhibition with leading companies and organizations showcasing their latest products and developments, and networking opportunities, including a reception and a conference gala dinner at a University college.

Conference Topics

• Flexible hybrid electronics (e.g. combination of organic and printed electronics with thinned and unpackaged silicon devices, stretchable hybrid electronics, novel interconnects)
• Emerging materials and devices for large-area electronics (e.g. stretchable, biocompatible and biodegradable substrates, organic and inorganic semiconductors, conductors and novel dielectrics, quantum dots, and magnetic materials)
• Energy harvesting and storage for large-area electronics (e.g. RF, piezo, thermal and solar harvesting, printable batteries and supercapacitors)
• Bio-electronics for applications in healthcare (e.g. biosensors and electronics to interface biological tissue)
• Internet of Things and large-area electronic sensor technologies (e.g. applications of LAE-based sensors for IoT, manufacturing technologies and applications of LAE components and systems for IoT and wireless sensor networks)
• Novel manufacturing paradigms for large-area electronics (e.g. photonic transfer, paper and fibre-based electronics, sheet-to-sheet and roll-to-roll flexible electronics, and novel aspects of metrology, reliability and yield)
• Smart wearables and stretchable/ultra-flexible electronics (e.g. applications of stretchable and ultra-flexible electronic technologies in smart wearables)